TTT

T-Mobile USA, Inc. 6.0% 15-JUN-2054

No trades
See on Supercharts
Overview
Analysis

TMUS5650474 analysis



Key facts


Issuer
T-Mobile USA, Inc.
Issue date
Sep 14, 2023
Maturity date
Jun 15, 2054
Outstanding amount
‪1.00 B‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
6.00% (Fixed)
Yield to maturity
5.80%
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.
Go deeper with bond data
Access the most important data for bonds including coupon rates, issue ratings, redemption data and more.